FrontRow · Jul 26, 2026
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Samsung Electronics said on Saturday it struck a pact with U.S. chip designer Broadcom to widen cooperation across memory chips, contract chip making and advanced packaging envisaged to exceed $200 billion until 2030. Winning long-term production commitments from Broadcom, one of the world’s leading custom AI chip designers, could boost utilization at Samsung’s advanced manufacturing facilities to pull ahead in the race to supply AI chips. “The expanded collaboration ... reflects Samsung’s focus on supporting customers with end-to-end semiconductor technologies across an increasingly diverse range of AI and high-performance computing applications,” the company said in a statement. The tie-up comes as global technology companies increasingly develop their own custom AI accelerators, rather than relying solely on general-purpose graphics processors, driving demand for specialized chip design and manufacturing partnerships. The two firms’ memorandum of understanding underscores Samsung’s efforts to beef up its position in AI semiconductors by expanding its long-term ties with Broadcom amid growing demand for custom AI processors.
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